MPi Logic Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is extensively used on gold bump and pad wafer testing for Exhibit driver, logic, and memory product. MPI’s cantilever probes are the corresponding respond to towards the needs of fi­ne pitch, smaller pad sizing, higher speed, a lot less cleansing, multi-DUT, superior pin count, and extremely-low leakage needs. With fantastic craftsmanship, ground breaking architecture and proven methodologies depending on mechanical and electrical simulation/measurement final results, generating MPI the highest cantilever company around the globe.


FCB Probe Card

The FCB Probe Card is considered the most experienced technological innovation of buckling beam probe card. It truly is aimed to accomplish the semiconductor ship manufacture time-to-market place (TTM) and value of examination (COT) need. FCB is really a confirmed solution for a variety of semiconductor output checks from early engineering pilot-runs to large volume producing (HVM). FCB is ready for gadget demanding significant signal integrity probing (SI) and/or energy integrity probing (PI). Applications involve slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and a lot more. FCB guarantees the earth’s ideal In general Charge-of-ownership (COO) for many DUT applications.


EVS Probe Card

The EVS Probe Card can be an enhancement over the traditional buckling beam probe card. Important options are increased present carrying ability (C.C.C.) and reduce well balanced Get in touch with drive (BCF), along with In general MEMS-like qualities. EVS can certainly meet the prerequisite of Sophisticated wafer probing. Exact alignment and excellent planarity Handle are the essential aspects contributing to stable contact resistance. With its potential and efficiency, EVS Probe Card is a perfect choice for Innovative probe playing cards.


Osprey probe card

The Osprey probe card is MPI’s website Remedy to need for ever finer pitch. It truly is created for scaled-down Al pad, and is ideal for small pitch application with peripheral and entire array sample. With specific alignment and better planarity Manage, Osprey can achieve better efficiency by multi-DUT structure.  The forming wire (FW) sort needle generated with MPI’s own micro fabrication approach don't just provides significant-quality effectiveness and also permits simple needle replacement and shortens retaining cycle time.



Kestrel Probe Card

The Kestrel Probe Card is supplied with MEMS wire (MW) needle which is made for the desire of low power probing. It also comes with the chance to fulfill large C.C.C. and higher pin counts application. The MEMS method makes sure really reliable needle properties, and the Exclusive composition style and design allows precise alignment and planarity Command.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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